Microsystems Engineers
SOC: 17-2199.06

Description:

Research, design, develop, or test microelectromechanical systems (MEMS) devices.


National Salary Information:

Hourly Statistics:

Annual Statistics:

Source: Bureau of Labor Statistics 2015 wage data.


Employment Projections:

Employment (2014):
136,900 employed

Projected (2024):
142,300 employed

Projected growth (2014-2024)


Source: Bureau of Labor Statistics 2015 2014-2024 employment projections external site. "Projected growth" represents the estimated change in total employment over the projections period (2014-2024). "Projected job openings" represent openings due to growth and replacement.


Alternate Titles:

  • Device Engineer
  • MEMS Device Scientist (Microelectromechanical Systems Device Scientist)
  • MEMS Engineer (Microelectromechanical Systems Engineer)
  • MEMS Process Engineer (Microelectromechanical Systems Process Engineer)
  • Microelectronics Engineer
  • Microsystems Engineer
  • Mobile Device Engineer
  • Nanotechnologist
  • Patent Engineer
  • Process Engineer
  • Semiconductor Engineer


  • Tasks:

  • Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications.
  • Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology.
  • Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays.
  • Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications.
  • Develop customer documentation, such as performance specifications, training manuals, or operating instructions.
  • Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems.
  • Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes.
  • Demonstrate miniaturized systems that contain components such as microsensors, microactuators, or integrated electronic circuits fabricated on silicon or silicon carbide wafers.
  • Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements.
  • Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications.
  • Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints.
  • Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements.
  • Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing.
  • Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software.
  • Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability.
  • Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining.
  • Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests.
  • Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement.
  • Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting.
  • Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints.
  • Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes.
  • Conduct analyses addressing issues such as failure, reliability, or yield improvement.
  • Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology.
  • Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing.
  • Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software.
  • Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology.
  • Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining.
  • Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices.
  • Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines.
  • Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications.
  • Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy.

  • Tools & Technology:

  • Atomic force microscopes AFM
  • Atomic layer deposition ALD systems
  • Chemical mechanical polishing CMP systems
  • Contact angle measurement systems
  • Contact mask aligners
  • Countdown timers
  • Critical point dryers
  • Curve tracers
  • Deionized water systems
  • Die saws
  • Digital multimeters
  • Direct current DC sputtering systems
  • Dry etchers
  • Electrochemical analyzers
  • Electron beam evaporators
  • Electronic balances
  • Ellipsometers
  • Extractive Fourier transform infrared FTIR spectrometers
  • Fluorescence spectrophotometers
  • Four point probes
  • Hotplates
  • Hydraulic presses
  • Impedance meters
  • Inductance capacitance resistance LCR meters
  • Inductively coupled plasma reactive ion etchers ICP-RIE
  • Inspection microscopes
  • Isolation glove boxes
  • Laminar flow flume hoods
  • Laser ablation thin film deposition systems
  • Mechanical probe stations
  • Metal evaporators
  • Network analyzers
  • Optical compound microscopes
  • Oscilloscopes
  • Oxidation furnaces
  • Parametric testers
  • Parylene coaters
  • Personal computers
  • pH meters
  • Photoresist dispensing systems
  • Picoammeters
  • Plasma enhanced chemical vapor deposition PECVD systems
  • Plasma etchers
  • Polarimeters
  • Profilometers
  • Pulse generators
  • Radio frequency RF sputtering systems
  • Raman scattering spectroscopes
  • Rapid thermal annealers RTA
  • Resistivity measurement systems
  • Scanning electron microscopes SEM
  • Semiconductor parameter analyzers
  • Signal generators
  • Spectrometers
  • Spectroscopic ellipsometers
  • Spin coaters
  • Sputter deposition systems
  • Stepper aligners
  • Thermal chambers
  • Thin film deposition systems
  • Thin film measurement systems
  • Time interval analyzers
  • Tube furnaces
  • Ultraviolet ozone cleaners
  • Vacuum chambers
  • Vibration measurement systems
  • Wet chemical etching systems
  • Wire bonders
  • X ray diffractometers
  • Adobe Systems Adobe Photoshop software
  • Anisotropic Crystalline Etch Simulation ACES software
  • ANSYS FLUENT
  • ANSYS LS-DYNA
  • ANSYS Multiphysics
  • Apple Macintosh OS
  • Autodesk AutoCAD software
  • Beige Bag Software B2 Spice
  • C
  • C++
  • Cadence PSpice
  • Cadence software
  • CAzM
  • Circuit simulation software
  • Computer aided design CAD software
  • COMSOL Multiphysics
  • Coventor ARCHITECT3D
  • Coventor CoventorWare
  • Dassault Systemes Abaqus
  • Dassault Systemes SolidWorks software
  • Dolphin Integration SMASH
  • Electric VLSI Design System
  • Finite element method FEM software
  • FLorida Object Oriented Design Simulator FLOODS
  • FLorida Object Oriented Process Simulator FLOOPS
  • IntelliCAD
  • Intusoft ICAP
  • IRSIM
  • KLA-Tencor PROLITH
  • Linear Technology LTSpice
  • Linux
  • MEMSCAP MEMS Pro
  • Mentor Graphics LeonardoSpectrum
  • Mentor Graphics ModelSim
  • Microelectromechanical systems MEMS simulation software
  • Microsoft Access
  • Microsoft Excel
  • Microsoft Office software
  • Microsoft Visual Basic
  • Microsoft Windows
  • Microsoft Word
  • Microwind Dsch
  • Molecular visualization software
  • MSC Software Patran
  • National Instruments LabVIEW
  • Penzar TopSPICE
  • PISCES IIB
  • Practical extraction and reporting language PERL
  • Process simulation software
  • PTC Creo Parametric
  • Python
  • Schematic capture software
  • Siemens PLM software
  • Simulation program with integrated circuit emphasis SPICE
  • Simulation software
  • SimWindows
  • Statistical process control SPC software
  • SUPREM
  • Syborg Systems MicroTec
  • Synopsys HSPICE
  • Synopsys Taurus Medici
  • Tanner EDA L-Edit
  • Tanner EDA T-SPICE
  • The MathWorks MATLAB
  • Transas Group PISCES2
  • UNIX
  • Very high speed integrated circuit VHSIC hardware description language VHDL simulation software
  • Web browser software
  • WinSpice
  • Xcircuit


  • architecture and engineering


    industry stats

    SOC: 17-0000

    Total Employed: 2,475,390

    Average Annual Salary: $82,980